Momentive TSE3070 is a two-component, high elongation silicone gel for electronic potting applications. This product cures at room temperature to a soft, tacky gel with the addition of curing agent. The soft nature and cushioning effect of this product provides excellent protection of electronic assemblies from external humidity, mechanical shock and vibration.
KEY PERFORMANCE PROPERTIES:
- Convenient 1:1 mix ratio by weight
- High elongation gel
- Low viscosity - easily pourable
- Room temperature curable and heat accelerated cure
- Soft, tacky and sticky gel
- Absorbs shock and protects delicate mechanical components from vibration
- Excellent electrical properties
- No reactive by-products; no concerns regarding corrosion
APPLICATIONS:
- Electrical and electronic potting such as hybrid IC and power module
- Mechanical cushioning and vibration damping material for delicate assemblies
For more information on Momentive TSE3070, please refer to the Technical Datasheet.