TIA208R Thermally Conductive Potting - 10kg KIT

Can be cured quickly with heat or at room temprarture

Price On Request

Momentive TIA208R is a 2-component, thermally conductive material for potting and gap filling. When cured at room temperature or quickly with heat, TIA208R cures to a thermally conductive rubber that adheres well to metal and plastic substrates without the need for primers. The flowability of TIA208R allows it to be potted and conform to complex 3-dimenstional shapes and cavities, filling voids and thereby creating a thermal path to remove heat.


  • Primerless adhesion to metals and plastics
  • Good thermal conductivity
  • Easy to use 1:1 mixing ratio
  • Cures and adheres quickly with heat or at room temperature
  • Flame retardant: UL94V-0 (planned)
  • UL RTI: 150°C (planned)


  • Thermal potting for power supplies, drivers in LED light bulbs, ballast and electronic devices.

For more information on Momentive TIA08R please refer to the Technical datasheet.