Momentive TSE3062 is a two-component, low viscosity silicone gel designed for electronic potting applications. this product cures at room temperature to a soft tacky gel with the addition of curing agent. The soft nature and cushioning effect of this product provided excellent protection of electronic assemblies from external humidity, mechanical shock and vibration.
KEY PERFORMANCE PROPERTIES:
- Convenient 1:1 mix ratio by weight
- Low viscosity - easily pourable
- Room temperature curable and heat accelerated cure
- Soft, tacky and sticky gel
- Absorbs shock and protects delicate mechanical components from vibration
- Excellent electrical properties
- Excellent resistance to temperature extremes
APPLICATIONS:
- Electrical and electronic potting such as hybrid IC and power module
- Potting of high voltage parts
For more information on TSE3062, please refer to the Technical Datasheet